Diffusion barrier and adhesive for PARMOD.TM. application to rigid printed wiring boards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 7, 2000
Grant Date -
N/A
app pub date -
Aug 6, 1999
filing date -
Aug 6, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
PARMOD.TM. materials comprised of a metal powder or metal powder mixture of specified characteristics and a Reactive Organic Medium, are easily printed or deposited on electronic components, such as a Printed Wiring Board substrate, and cured at low temperatures to form a highly conductive, well bonded, well consolidated pure metal component. The adhesion of PARMOD.TM. conductors on an electronic component is enhanced by printing the PARMOD.TM. on a polyimide coating which has been applied to the electronic component.
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