Bump electrode with adjacent pad and insulation for solder flow stopping
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 7, 2000
Grant Date -
N/A
app pub date -
May 28, 1996
filing date -
May 26, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A connection electrode structure includes a wiring conductor layer formed on a printed wiring board, a bump electrode portion formed on an outer end portion of the wiring conductor layer and formed by an electroplating of Cu, a pad electrode portion formed inwardly adjacent to the bump electrode portion and continuous with it, a Ni/Au layer covering the bump electrode portion and the pad electrode portion, and a solder resist layer formed on a portion of the wiring conductor layer at an inside of the pad electrode portion to stop solder flow.
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