High-operating-temperature electronic component
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 7, 2000
Grant Date -
N/A
app pub date -
Mar 24, 1999
filing date -
Mar 24, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A product for attaching an electronic component, such as a semiconductor die, to a substrate includes a relatively low-melting-temperature solder preform applied to the substrate; and a bead of a curable bonding material applied to the substrate around the periphery of the solder preform in an amount sufficient to substantially contain the solder material and bridge the gap between the die and the substrate upon a subsequent collapse of the solder preform along its thickness dimension.
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