Vertical needle type probe card, method of manufacturing thereof, method of replacing defective probe needle and test method of wafer using the probe card
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 7, 2000
Grant Date -
N/A
app pub date -
Apr 7, 1998
filing date -
Oct 21, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A main object of the present invention is to provide a vertical needle type probe card which is improved so that necessary needle pressure is obtained even if variation of the probe needles in the height direction is larger to some extent. The upper portion of a probe needle is supported by an upper guide plate. The lower portion of probe needle is supported by a lower guide plate. Upper portion of probe needle is bent into an L shape. A conductive rubber sheet and a printed wiring board are provided on upper guide plate.
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