Semiconductor workpiece cleaning method and apparatus

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United States of America Patent

PATENT NO 6145519
SERIAL NO

08857364

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Abstract

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A semiconductor workpiece cleaning apparatus includes a cleaning arrangement that cleans a semiconductor workpiece by use of a cleaning liquid, a charging arrangement that brings into a chamber a drying liquid, and a discharging arrangement that discharges the cleaning liquid. The cleaning arrangement cleans the workpiece by spraying chemical liquid and/or pure water in the chamber, and by immersing the workpiece in the chemical liquid and/or pure water. The charging arrangement takes in the drying chemical liquid or vapor so as to contact the processing chemical liquid or pure water in which the semiconductor workpiece is immersed. The discharging arrangement discharges the processing chemical liquid or pure water while preserving an interface between the processing chemical liquid or pure water and the drying chemical liquid or vapor.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI DENKI KABUSHIKI KAISHA2-3 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ban, Cozy Tokyo, JP 20 374
Konishi, Toko Tokyo, JP 7 114

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