Non-connected drainage channels for selective wave solder pallets
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 14, 2000
Grant Date -
N/A
app pub date -
Jun 18, 1998
filing date -
Jun 18, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wave solder pallet having a first side that is adapted to receive a printed circuit board and a plurality of through holes or apertures that will allow solder to be transmitted through to selected regions on the printed circuit board. The surface of the base plate that is positioned adjacent the solder wave has channels formed therein, the channels being tapered inwardly so that the overall volume of the channel is greatest at the periphery of the pallet. The increased volume of the channel reduces the pressure effect of the solder wave as it contacts the pallet at the periphery thereby reducing the amount of solder that is splashed over the pallet. The tapering of the channel uniformly increases the pressure so that the pressure effect of the solder wave is increased when it travels through the apertures. Moreover, at a location adjacent the through holes, the surface of the pallet is closer to the solder wave than at some other locations, so as to increase the pressure effect of the solder wave within the adjacent aperture.
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