Semiconductor wafer treatment
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Nov 14, 2000
Issued Date -
N/A
app pub date -
Mar 5, 1999
filing date -
Jun 29, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Method and apparatus for cleaning semiconductor devices and other workpieces using an aqueous rinse solution which is de-oxygenated and hydrogen enriched by passing the aqueous rinse solution and a treatment fluid through an osmotic membrane degasifier. In the preferred embodiment, only a single component, forming gas, is employed to provide both functions of oxygen removal and hydrogen injection.
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