PDC cutter element having improved substrate configuration
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United States of America Patent
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-
Nov 21, 2000
Issued Date -
N/A
app pub date -
Aug 6, 1997
filing date -
Jun 13, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A supporting substrate for supporting a diamond layer on a cutting element is disclosed which has an irregular surface defining the interface between the substrate and the diamond layer. The irregularities in the surface may have varying amplitudes, varying frequencies, or both and can vary according to defined mathematical expressions. The irregularities may assume recognizable geometric forms, such as spiral, circle or wave configurations, or may be arranged in an irregular manner. The surface is constructed with or without a plane of symmetry and may have different average amplitudes and/or frequencies in different areas.
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