Direct temperature sensing of a semiconductor device semiconductor device
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United States of America Patent
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Nov 21, 2000
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N/A
app pub date -
Dec 11, 1997
filing date -
Dec 11, 1997
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Abstract
An apparatus and method for directly measuring the operating temperature of a semiconductor device. A temperature sensor is placed directly on the substrate containing the device whose temperature is of interest. The circuitry used to process the sensor signals is on a separate substrate. Because the sensor is on the same substrate as the device of interest, noise is produced in the sensor signals as a result of electrons injected into the substrate by the device. The present invention includes methods for cancelling the noise and error in the temperature measurements to provide a very accurate determination of the device's operating temperature.
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