Method and apparatus for singulating semiconductor devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 21, 2000
Grant Date -
N/A
app pub date -
Jul 27, 1998
filing date -
Jul 27, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Method and apparatus for singulating semiconductor devices (21) is provided. This approach eliminates the need for an adhesive tape. A fixture (10) is provided to hold the joined semiconductor devices. The fixture has grooves (14 and 18) to accommodate a saw blade (35). The saw makes a cut in two directions thereby separating or singulating the semiconductor devices. Bars (24) are placed across the semiconductor devices when sawing in the second direction to hold the semiconductor devices in the holding fixture. A pick and place machine can then be used to remove the singulated semiconductor devices from the holding fixture.
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