Semiconductor device with radiation plate for high radiation character and method of manufacturing the same
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United States of America Patent
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Nov 21, 2000
Grant Date -
N/A
app pub date -
Jul 28, 1998
filing date -
Aug 5, 1997
priority date (Note) -
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Abstract
A semiconductor device of the present invention comprises a semiconductor pellet, a radiation plate mounted with the semiconductor pellet, a plurality of lead terminals electrically connected with the semiconductor pellet, and a resin member for encapsulating the above items. The resin member has a first surface and a second surface, and the radiation plate has a first portion exposed to the outside from the first surface of the resin member and a second portion exposed to the outside from the second surface of the resin member.
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