Component carrier with raised bonding sites
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 21, 2000
Grant Date -
N/A
app pub date -
Jun 2, 1998
filing date -
Sep 6, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection structure. These articles are produced with screening and printing processes using a screening head and printing machine.
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