IC socket having standoffs
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 28, 2000
Grant Date -
N/A
app pub date -
Aug 5, 1999
filing date -
Apr 6, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A socket for interconnecting a PGA package with a circuit board comprises a base, a cover slidably attached to the base, and supporting means downwardly extending from the base. The base comprises a pair of extension plates diagonally extending therefrom. The supporting means in the form of a pair of standoffs is formed on the respective extension plates. Since each standoff has a height slightly smaller than that of solder balls formed on a lower surface of the base, the standoffs rest on the circuit board after the socket is soldered thereto. By such a design, the external force employed to actuate the cover to slide along the base is transferred from the base to the standoffs. Hence, deformation of the base and damage to the solder joint are obviated to ensure a reliable connection between the PGA package and the circuit board.
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