Diode device
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United States of America Patent
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-
Nov 28, 2000
Grant Date -
N/A
app pub date -
Nov 5, 1999
filing date -
Nov 5, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed is a diode device in which two electrodes of regions forming both terminals are provided on the same face, thereby enabling the device to be connected to a circuit substrate by face-down bonding. Since a region is located within the semiconductor base, an electrode cannot be connected at the top face thereof; to overcome this, a groove is provided extending in a perpendicular direction from the top face of the semiconductor base to the region, and an electrode is provided in the groove. Then, the electrode in the groove is exposed at the top face, enabling the electrodes of both regions to be connected at the top face.
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