Substrate for semiconductor package, fabrication method thereof, and stacked-type semiconductor package using the substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 28, 2000
Grant Date -
N/A
app pub date -
May 16, 1997
filing date -
May 17, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A substrate for a semiconductor package, a fabrication method for the substrate, thereof and a stacked-type semiconductor package using the substrate, and a method of making the package are disclosed. The substrate includes: an insulator having top and bottom surfaces, there being upper and lower recesses respectively formed in the top and bottom surfaces of the insulator; plural first upper and lower conductive lines respectively formed at least in part on exposed surface of the upper and lower recesses; and plural second upper and lower conductive lines respectively formed at least in part on the top and bottom surfaces and connected with corresponding ones of the first upper and lower conductive lines, respectively, the second upper and lower conductive lines extending outwardly from the upper and lower recesses, respectively.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully