Recessed flip-chip package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 28, 2000
Grant Date -
N/A
app pub date -
Jul 21, 1998
filing date -
Jul 21, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The specification describes a recessed chip IC package in which the cavity in the printed wiring board into which the IC chip is recessed is used as a through hole interconnection, thus increasing the interconnection density. If the through cavity interconnections are used as power and ground the signal I/O pads and the signal runners are effectively isolated.
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