Printed circuit board assembly and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 28, 2000
Grant Date -
N/A
app pub date -
Sep 30, 1998
filing date -
Sep 30, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed circuit board assembly incorporates an opening into which one or more integrated circuit packages at least partially fit, a plurality of electrical connection pads are disposed about the periphery of the opening, corresponding leads of the integrated circuit package are bonded to the pads, and the overall assembly is thinner than an assembly lacking the opening.
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