Lead conditioning system
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Dec 5, 2000
Issued Date -
N/A
app pub date -
Dec 29, 1998
filing date -
Jul 1, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A system for conditioning the leads of a semiconductor device. The system includes a base having anvil surfaces configured to form the leads to a predetermined shape, and forming arms mounted to the base. An actuator is movable relative to the base to move the forming arms from a first position, with the forming arm spaced from the leads, to a second position, with the forming arm urging the leads against the anvil surface to form the leads to a predetermined configuration. Adjustment means adjust the position of said anvil and arms. A video scanner scans sample semiconductor devices and generates lead dimension and configuration signals. A processor processes said signals and applies the processed signals to the adjustment means to form leads of a semiconductor device to predetermined dimensions and configuration.
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