Stack arrangement for two semiconductor memory chips and printed board for accepting a plurality of such stack arrangements
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United States of America Patent
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-
Dec 5, 2000
Grant Date -
N/A
app pub date -
Dec 21, 1998
filing date -
Dec 30, 1997
priority date (Note) -
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Abstract
Two semiconductor memory chips are placed onto a flexible wiring and are shaped by simple folding of the flexible wiring about a central elastic line, into a space-efficient stack arrangement whose outer contacts are formed only at one marginal side. To form memory cards, a plurality of such stack arrangements can be placed onto a simply constructed printed board.
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