Ultra-low particle semiconductor cleaner
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United States of America Patent
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Dec 12, 2000
Issued Date -
N/A
app pub date -
Sep 4, 1998
filing date -
Nov 14, 1994
priority date (Note) -
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Abstract
A method for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.
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