Process for the corrosion protection of copper or copper alloys
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United States of America Patent
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Dec 12, 2000
Grant Date -
N/A
app pub date -
Aug 28, 1997
filing date -
Dec 23, 1994
priority date (Note) -
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Abstract
A process for the corrosion protection of copper or copper alloy which process comprises contacting the surface with an aqueous solution of at least one compound of general formula (I), wherein X is N, Y is CR and Z is N, or X is N, Y is N and Z is N or CR or X is CR, Y is N and Z is N, where R is a hydrogen atom or R.sup.1, and R.sup.1 is an alkyl, aryl, aralkyl, halogen, trihalomethyl, amino, heterocyclic, NHR.sup.2, NR.sup.3 R.sup.4, CN, CO.sub.2 H, CO.sub.2 R.sup.5, OH or OR.sup.6 group, where each of R.sup.2 to R.sup.6 independently represents an alkyl, aryl, or aralkyl group. ##STR1##
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