End effector for pad conditioning
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United States of America Patent
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-
Dec 12, 2000
Grant Date -
N/A
app pub date -
Feb 2, 1999
filing date -
Feb 11, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An end effector is provided for conditioning pads used to polish semiconductor wafers. The end effector has a substrate with a matrix (preferably a polymer) disposed thereon. Abrasive particles such as diamond crystals are embedded in the matrix. Preferred particle size and number/spacing is provided for optimal conditioning. The particles are embedded by at least a predetermined amount (e.g., 75%) so as to provide uniform/repeatable conditioning while avoiding dislodged particles. The particles may be embedded such that the tips thereof are coplanar, or such that the profile of diamond tips form a plurality of curved regions. A method for checking end effector quality is also provided.
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