Apparatus and method for applying heat bondable lamina to a substrate

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United States of America Patent

PATENT NO 6159327
SERIAL NO

09075088

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Apparatus and method for making a plurality of substrates laminated on two sides by applying a plurality of laminate sheets to corresponding plurality of substrates. The apparatus includes a lamina supply member capable of holding a supply of lamina from which successive sheets of lamina can be cut. One or more cutters are disposed in the apparatus such that the cutters are capable of cutting through the lamina to provide successive sheets of laminate. One or more heaters are provided for bonding sheets of laminate to corresponding sides of a substrate whereby the corresponding top and bottom laminated substrate is formed. The supply of lamina is characterized by a current leading edge. The supply of lamina is cut through along a cutting line at a predetermined distance from the current leading edge of the lamina. This provides a first sheet of laminate having a trailing edge at the cutting line. Cutting also provides the lamina supply with a successive leading edge at the cutting line. There is substantially no wasted lamina material between the trailing edge of the laminate sheet and the successive leading edge of the lamina. The laminate sheets are then bonded to the top and bottom sides of a corresponding substrate. The steps of cutting the lamina along a cutting line and bonding the resultant laminate sheets to the top and bottom sides of a corresponding substrate are repeated a plurality of times to yield the plurality of laminated substrates.

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Patent Owner(s)

Patent OwnerAddress
L-1 SECURE CREDENTIALING INC63 THIRD AVENUE BURLINGTON MA 01803

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Forkert, Maurice J Fort Wayne, IN 5 294

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