Electric potential shaping method for electroplating
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United States of America Patent
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Dec 12, 2000
Grant Date -
N/A
app pub date -
Nov 13, 1997
filing date -
Nov 13, 1997
priority date (Note) -
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Abstract
An apparatus for depositing an electrically conductive layer on the surface of a wafer comprises a flange. The flange has a cylindrical wall and an annulus attached to a first end of the cylindrical wall. The annulus shields the edge region of the wafer surface during electroplating reducing the thickness of the deposited electrically conductive layer on the edge region. Further, the cylindrical wall of the flange can be provided with a plurality of apertures adjacent the wafer allowing gas bubbles entrapped on the wafer surface to readily escape.
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