US Patent No: 6,160,218
Number of patents in Portfolio can not be more than 2000
Chip housing
Stats
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Dec 12, 2000
Issued date -
Oct 6, 1997
filing date -
08/894,604
serial no -
In Force
status
Importance
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Abstract
A housing to accept at least one electronic component, e.g., a chip with a cover and an opposing cover. The cover and opposing cover are formed to surround the component. On the inner surface of the cover and the opposing cover, there are conductive paths arranged such that the paths on the cover connect terminal areas of the component to the paths on the opposing cover and the paths on the opposing cover open into external terminals of the housing. The cover and/or the opposing cover is/are flexible and are suitable to be interconnected with surrounding sub-housings.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 5,401,688 Semiconductor device of multichip module-type | 20 | 1993 | |
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| 4,941,033 Semiconductor integrated circuit device | 70 | 1989 | |
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| 5,631,191 Method for connecting a die to electrically conductive traces on a flexible lead-frame | 27 | 1995 | |