US Patent No: 6,160,218

Number of patents in Portfolio can not be more than 2000

Chip housing

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A housing to accept at least one electronic component, e.g., a chip with a cover and an opposing cover. The cover and opposing cover are formed to surround the component. On the inner surface of the cover and the opposing cover, there are conductive paths arranged such that the paths on the cover connect terminal areas of the component to the paths on the opposing cover and the paths on the opposing cover open into external terminals of the housing. The cover and/or the opposing cover is/are flexible and are suitable to be interconnected with surrounding sub-housings.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
PAC TECH - PACKAGING TECHNOLOGIES GMBHNAUEN43

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Azdasht, Ghassem Berlin, DE 68 328
Reichl, Herbert Berlin, DE 11 33
Zakel, Elke Falkensee, DE 68 394

Cited Art Landscape

Patent Info (Count) # Cites Year
 
KABUSHIKI KAISHA TOSHIBA (1)
5,401,688 Semiconductor device of multichip module-type 21 1993
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
4,941,033 Semiconductor integrated circuit device 74 1989
 
POLY-FLEX CIRCUITS, INC (1)
5,631,191 Method for connecting a die to electrically conductive traces on a flexible lead-frame 32 1995

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (1)
7,023,079 Stacked semiconductor chip package 5 2002
 
AIRBUS OPERATIONS GMBH (1)
7,556,220 Seal for sealing a component opening in a component 1 2005
 
NISSAN MOTOR CO., LTD. (1)
7,521,795 Semiconductor package 0 2005