Heat pipe attached to a printed wiring board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 12, 2000
Grant Date -
N/A
app pub date -
Jun 3, 1998
filing date -
Jun 3, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multi-layer printed wiring board includes multiple dielectric cores and conductive layers. The conductive layers include a first layer having a first thickness and a first set of line widths, and a second layer having a second thickness and a second set of line widths. The first thickness is greater than the second thickness. A heat pipe is attached to the printed willing board rather than to an integrated circuit with surface mounting, connection by through holes or with tabs.
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Family
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Cited Art Landscape
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