Double-sided programmable interconnect structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Dec 12, 2000
Issued Date -
N/A
app pub date -
Jun 25, 1999
filing date -
Oct 15, 1990
priority date (Note) -
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Importance
Abstract
An interconnect structure is centered around a substrate having opposite first and second surfaces. Component contacts allocated to cells in the substrate, are provided over both substrate surfaces. Conductive leads extend over each surface in two different directions. The conductive leads are selectively connected to the component contacts. The interconnect structure includes a capability for programmability electrically connecting, or disconnecting, the conductive leads in a desired manner.
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