US Patent No: 6,160,412

Number of patents in Portfolio can not be more than 2000

Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment

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Abstract

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An interconnection device used with test probe equipment for connecting a vertical-pin integrated circuit probing device to external test equipment. The interconnection device comprises a probe card with a pattern of contacts, a mounting plate adjustably mounted to the probe card and a space transformer member attached to both the mounting plate and the probe card. The space transformer carries traces which connect a small pattern of pins on the probing device with a larger pattern of conductors on the probe card. The space transformer is a laminated impedance-matching member comprising two layers of beryllium copper separated by a thin dielectric adhesive.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
WENTWORTH LABORATORIES, INC.BROOKFIELD, CT27

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Martel, Anthony Paul New Fairfield, CT 2 88
McQuade, Francis T Watertown, CT 18 220

Cited Art Landscape

Patent Info (Count) # Cites Year
 
WENTWORTH LABORATORIES, INC. (2)
4,975,638 Test probe assembly for testing integrated circuit devices 149 1989
5,416,429 Probe assembly for testing integrated circuits 84 1994
 
Bell Telephone Laboratories, Incorporated (1)
4,901,013 Apparatus having a buckling beam probe assembly 44 1988
 
TOKYO ELECTRON LIMITED (1)
5,635,846 Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer 142 1993

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
FormFactor, Inc. (27)
6,483,328 Probe card for probing wafers with raised contact elements 59 1998
7,396,236 Wafer level interposer 8 2001
6,856,150 Probe card with coplanar daughter card 84 2001
6,729,019 Method of manufacturing a probe card 103 2001
6,816,031 Adjustable delay transmission line 71 2001
6,864,105 Method of manufacturing a probe card 68 2002
7,195,503 Electrical contactor, especially wafer level contactor, using fluid pressure 5 2002
7,122,760 Using electric discharge machining to manufacture probes 2 2002
6,945,827 Microelectronic contact structure 40 2002
7,168,162 Method of manufacturing a probe card 3 2004
7,262,611 Apparatuses and methods for planarizing a semiconductor contactor 12 2004
7,057,474 Adjustable delay transmission lines 6 2004
7,116,119 Probe card with coplanar daughter card 22 2005
7,196,531 Method of manufacturing a probe card 6 2005
7,731,546 Microelectronic contact structure 2 2005
7,239,220 Adjustable delay transmission line 1 2006
7,488,917 Electric discharge machining of a probe array 0 2006
7,455,540 Electrical contactor, especially wafer level contactor, using fluid pressure 2 2007
7,400,157 Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes 3 2007
7,683,738 Adjustable delay transmission line 0 2007
7,737,709 Methods for planarizing a semiconductor contactor 1 2007
7,649,368 Wafer level interposer 0 2008
7,948,252 Multilayered probe card 0 2008
7,722,371 Electrical contactor, especially wafer level contactor, using fluid pressure 0 2008
8,373,428 Probe card assembly and kit, and methods of making same 4 2009
7,967,621 Electrical contactor, especially wafer level contactor, using fluid pressure 0 2010
8,427,183 Probe card assembly having an actuator for bending the probe substrate 1 2011
 
CASCADE MICROTECH, INC. (16)
7,355,420 Membrane probing system 4 2002
7,178,236 Method for constructing a membrane probe using a depression 7 2003
7,761,986 Membrane probing method using improved contact 2 2003
7,400,155 Membrane probing system 0 2004
7,266,889 Membrane probing system 8 2005
7,368,927 Probe head having a membrane suspended probe 21 2005
7,550,983 Membrane probing system with local contact scrub 0 2006
7,533,462 Method of constructing a membrane probe 0 2006
7,681,312 Membrane probing system 1 2007
7,541,821 Membrane probing system with local contact scrub 0 2007
7,492,175 Membrane probing system 3 2008
7,514,944 Probe head having a membrane suspended probe 2 2008
7,888,957 Probing apparatus with impedance optimized interface 3 2008
7,893,704 Membrane probing structure with laterally scrubbing contacts 3 2009
8,410,806 Replaceable coupon for a probing apparatus 0 2009
8,451,017 Membrane probing method using improved contact 0 2010
 
WENTWORTH LABORATORIES, INC. (8)
6,633,175 Temperature compensated vertical pin probing device 5 2000
6,566,898 Temperature compensated vertical pin probing device 18 2001
6,906,540 Method for chemically etching photo-defined micro electrical contacts 12 2001
6,756,797 Planarizing interposer for thermal compensation of a probe card 11 2002
6,661,244 Nickel alloy probe card frame laminate 9 2002
6,927,586 Temperature compensated vertical pin probing device 59 2003
6,977,515 Method for forming photo-defined micro electrical contacts 3 2003
7,282,936 Die design with integrated assembly aid 2 2004
 
3M INNOVATIVE PROPERTIES COMPANY (2)
6,447,328 Method and apparatus for retaining a spring probe 15 2001
6,902,416 High density probe device 74 2002
 
ADVANTEST CORPORATION (1)
6,859,054 Probe contact system using flexible printed circuit board 12 2003
 
DELAWARE CAPITAL FORMATION, INC. (1)
6,414,504 Coaxial tilt pin fixture for testing high frequency circuit boards 5 1999
 
DSL Labs, Incorporated (1)
8,264,248 Micro probe assembly 0 2007
 
Formfactor, et al. (1)
6,937,037 Probe card assembly for contacting a device with raised contact elements 61 2002
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
6,441,632 Spring probe contactor for testing PGA devices 2 2001
 
INTEST CORPORATION (1)
7,141,993 Interface apparatus for integrated circuit testing 0 2002
 
MESATRONIC S.A. (1)
7,425,837 Spatial transformer for RF and low current interconnect 0 2006
 
MPI CORPORATION (1)
8,638,116 Probe card having configurable structure for exchanging or swapping electronic components for impedance matching and impedance matching method therefore 0 2011
 
SV PROBE PTE LTD. (1)
7,180,315 Substrate with patterned conductive layer 2 2005
 
The Boeing Company (1)
6,690,252 RF circuit assembly 0 2001
 
W. L. GORE & ASSOCIATES, INC. (1)
7,015,708 Method and apparatus for a high frequency, impedance controlled probing device with flexible ground contacts 94 2003

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