
US Patent No: 6,160,412
Number of patents in Portfolio can not be more than 2000
Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment
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Dec 12, 2000
Issued date -
Nov 5, 1998
filing date -
09/186,084
serial no -
In Force
status
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Abstract
An interconnection device used with test probe equipment for connecting a vertical-pin integrated circuit probing device to external test equipment. The interconnection device comprises a probe card with a pattern of contacts, a mounting plate adjustably mounted to the probe card and a space transformer member attached to both the mounting plate and the probe card. The space transformer carries traces which connect a small pattern of pins on the probing device with a larger pattern of conductors on the probe card. The space transformer is a laminated impedance-matching member comprising two layers of beryllium copper separated by a thin dielectric adhesive.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 4,975,638 Test probe assembly for testing integrated circuit devices | 144 | 1989 | |
| 5,416,429 Probe assembly for testing integrated circuits | 78 | 1994 | |
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| 4,901,013 Apparatus having a buckling beam probe assembly | 42 | 1988 | |
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| 5,635,846 Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer | 130 | 1993 | |