US Patent No: 6,160,412

Number of patents in Portfolio can not be more than 2000

Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment

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Importance

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Abstract

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An interconnection device used with test probe equipment for connecting a vertical-pin integrated circuit probing device to external test equipment. The interconnection device comprises a probe card with a pattern of contacts, a mounting plate adjustably mounted to the probe card and a space transformer member attached to both the mounting plate and the probe card. The space transformer carries traces which connect a small pattern of pins on the probing device with a larger pattern of conductors on the probe card. The space transformer is a laminated impedance-matching member comprising two layers of beryllium copper separated by a thin dielectric adhesive.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
WENTWORTH LABORATORIES, INC.BROOKFIELD, CT22

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Martel, Anthony Paul New Fairfield, CT 2 88
McQuade, Francis T Watertown, CT 18 229

Cited Art Landscape

Patent Info (Count) # Cites Year
 
WENTWORTH LABORATORIES, INC. (2)
* 4,975,638 Test probe assembly for testing integrated circuit devices 149 1989
* 5,416,429 Probe assembly for testing integrated circuits 86 1994
 
Bell Telephone Laboratories, Incorporated (1)
* 4,901,013 Apparatus having a buckling beam probe assembly 45 1988
 
TOKYO ELECTRON LIMITED (1)
* 5,635,846 Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer 152 1993
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
6,441,632 Spring probe contactor for testing PGA devices 2 2001
 
DSL Labs, Incorporated (1)
8,264,248 Micro probe assembly 0 2007
 
3M INNOVATIVE PROPERTIES COMPANY (2)
* 6,447,328 Method and apparatus for retaining a spring probe 15 2001
6,902,416 High density probe device 74 2002
 
INTEST CORPORATION (1)
7,141,993 Interface apparatus for integrated circuit testing 0 2002
 
WENTWORTH LABORATORIES, INC. (8)
6,633,175 Temperature compensated vertical pin probing device 5 2000
6,566,898 Temperature compensated vertical pin probing device 19 2001
6,906,540 Method for chemically etching photo-defined micro electrical contacts 12 2001
6,756,797 Planarizing interposer for thermal compensation of a probe card 12 2002
6,661,244 Nickel alloy probe card frame laminate 11 2002
6,927,586 Temperature compensated vertical pin probing device 59 2003
6,977,515 Method for forming photo-defined micro electrical contacts 3 2003
7,282,936 Die design with integrated assembly aid 2 2004
 
FormFactor, Inc. (27)
6,483,328 Probe card for probing wafers with raised contact elements 60 1998
7,396,236 Wafer level interposer 8 2001
6,856,150 Probe card with coplanar daughter card 85 2001
6,729,019 Method of manufacturing a probe card 105 2001
6,816,031 Adjustable delay transmission line 71 2001
* 6,864,105 Method of manufacturing a probe card 68 2002
7,195,503 Electrical contactor, especially wafer level contactor, using fluid pressure 5 2002
7,122,760 Using electric discharge machining to manufacture probes 2 2002
6,945,827 Microelectronic contact structure 42 2002
7,168,162 Method of manufacturing a probe card 4 2004
7,262,611 Apparatuses and methods for planarizing a semiconductor contactor 12 2004
7,057,474 Adjustable delay transmission lines 6 2004
7,116,119 Probe card with coplanar daughter card 23 2005
7,196,531 Method of manufacturing a probe card 8 2005
7,731,546 Microelectronic contact structure 3 2005
7,239,220 Adjustable delay transmission line 1 2006
7,488,917 Electric discharge machining of a probe array 0 2006
7,455,540 Electrical contactor, especially wafer level contactor, using fluid pressure 2 2007
7,400,157 Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes 3 2007
7,683,738 Adjustable delay transmission line 0 2007
7,737,709 Methods for planarizing a semiconductor contactor 2 2007
7,649,368 Wafer level interposer 1 2008
7,948,252 Multilayered probe card 3 2008
7,722,371 Electrical contactor, especially wafer level contactor, using fluid pressure 0 2008
8,373,428 Probe card assembly and kit, and methods of making same 13 2009
7,967,621 Electrical contactor, especially wafer level contactor, using fluid pressure 0 2010
8,427,183 Probe card assembly having an actuator for bending the probe substrate 2 2011
 
CASCADE MICROTECH, INC. (16)
7,355,420 Membrane probing system 5 2002
7,178,236 Method for constructing a membrane probe using a depression 7 2003
7,761,986 Membrane probing method using improved contact 2 2003
7,400,155 Membrane probing system 0 2004
7,266,889 Membrane probing system 8 2005
7,368,927 Probe head having a membrane suspended probe 24 2005
7,550,983 Membrane probing system with local contact scrub 0 2006
7,533,462 Method of constructing a membrane probe 0 2006
7,681,312 Membrane probing system 1 2007
7,541,821 Membrane probing system with local contact scrub 0 2007
7,492,175 Membrane probing system 3 2008
7,514,944 Probe head having a membrane suspended probe 3 2008
7,888,957 Probing apparatus with impedance optimized interface 4 2008
7,893,704 Membrane probing structure with laterally scrubbing contacts 3 2009
8,410,806 Replaceable coupon for a probing apparatus 1 2009
8,451,017 Membrane probing method using improved contact 1 2010
 
DELAWARE CAPITAL FORMATION, INC. (1)
* 6,414,504 Coaxial tilt pin fixture for testing high frequency circuit boards 6 1999
 
SV PROBE PTE LTD. (1)
7,180,315 Substrate with patterned conductive layer 2 2005
 
The Boeing Company (1)
* 6,690,252 RF circuit assembly 0 2001
 
MPI CORPORATION (2)
* 8,638,116 Probe card having configurable structure for exchanging or swapping electronic components for impedance matching and impedance matching method therefore 0 2011
* 2011/0221,462 PROBE CARD HAVING CONFIGURABLE STRUCTURE FOR EXCHANGING OR SWAPPING ELECTRONIC COMPONENTS FOR IMPEDANCE MATCHING AND IMPEDANCE MATCHING METHOD THEREFORE 0 2011
 
Formfactor, et al. (1)
6,937,037 Probe card assembly for contacting a device with raised contact elements 62 2002
 
MESATRONIC S.A. (1)
7,425,837 Spatial transformer for RF and low current interconnect 0 2006
 
W. L. GORE & ASSOCIATES, INC. (1)
7,015,708 Method and apparatus for a high frequency, impedance controlled probing device with flexible ground contacts 94 2003
 
ADVANTEST CORPORATION (1)
6,859,054 Probe contact system using flexible printed circuit board 12 2003
* Cited By Examiner