IC module and IC card

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United States of America Patent

PATENT NO 6160526
SERIAL NO

09242748

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An IC module incorporated in an IC-card includes a substrate, an IC chip mounted on the substrate, and an antenna coil electrically connected to the IC chip. The antenna coil includes a conductive film which is patterned on a surface of the substrate, thereby facilitating fabrication of the IC module while realizing a thickness reduction of the IC module.

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Patent Owner(s)

Patent OwnerAddress
ROHM CO LTD21 SAIIN MIZOSAKI-CHO UKYO-KU KYOTO-SHI KYOTO 615-8585

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirai, Minoru Kyoto, JP 23 567
Horio, Tomoharu Kyoto, JP 41 499
Miyata, Osamu Kyoto, JP 59 868
Ueda, Shigeyuki Kyoto, JP 40 572

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