Molded electronic package and method of preparation
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United States of America Patent
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-
Dec 12, 2000
Grant Date -
N/A
app pub date -
Dec 31, 1997
filing date -
Dec 31, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved way of preparing packaged electronic circuitry using molded plastics, ceramic Thick Film technology, and Polymer Thick Film technology. In this invention at least one of the electronic devices in the package is supported in a plastic molded substrate, and the circuit traces area added to the surface of the electronic device.
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