Enhanced duty cycle design for micro thermoelectromechanical coolers
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United States of America Patent
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Dec 19, 2000
Grant Date -
N/A
app pub date -
Dec 28, 1998
filing date -
Dec 28, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A thermoelectric cooling apparatus which includes a Peltier device or a thermoelectric element coupled to a hot source and a cold sink. The hot source dissipates heat produced by the thermoelectric element. The cold sink is coupled to a mass to be cooled. A means for supplying power to the thermoelectric element is provided and a means for selectively thermally coupling the thermoelectric element to the hot source is provided. Selectively thermally switching the thermoelectric element to the hot source allows heat to be dissipated to the hot source when the thermoelectric element possesses excess heat. Dissipating the excess heat when the excess heat is present allows higher efficiencies to be attained in thermoelectric cooling.
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