Adhesives and sealants containing adhesion promoter comprising waste powder prime
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Dec 19, 2000
Grant Date -
N/A
app pub date -
Nov 30, 1998
filing date -
Dec 4, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Waste powder prime comprising from about 30 to about 70 weight percent epoxy resin, the balance of the waste powder prime comprising filler, pigment and/or curing agent, is advantageously employed as a replacement for epoxy resins in conventional adhesion promoter systems for polymeric plastisols. The resulting compositions are useful as adhesives and sealants in industrial manufacturing processes such as in the manufacture of automobiles.
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Cited Art Landscape
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