Light emitting element module with a parallelogram-shaped chip and a staggered chip array
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United States of America Patent
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Dec 19, 2000
Issued Date -
N/A
app pub date -
Apr 30, 1999
filing date -
Sep 15, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A light emitting element module is provided in which plural chips, each of which includes plural light emitting elements, are arranged on a board. One side surface of each chip is expressed as a first side surface and another side surface of the chip which intersects the first side surface is expressed as a second side surface. Light emitting elements are located aside the first side surface at the upper side of the chip and arranged along the first side surface of said chips. The chips are arranged on the board so that at least two chips are displaced from each other to the right and left sides with respect to the chip alignment. Particularly, the plural chips may be disposed in a staggered arrangement on a board.
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