Low noise method for interconnecting analog and digital integrated circuits
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United States of America Patent
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Dec 19, 2000
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N/A
app pub date -
Aug 10, 1999
filing date -
Oct 30, 1997
priority date (Note) -
Expired
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Abstract
An apparatus and method for interconnecting digital and analog circuitry on separate substrates within a single integrated chip package attenuates logic level signals on one substrate, transmits the attenuated signals to another substrate, and amplifies the attenuated signals back to logic level signals.
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