Hybrid module and methods for manufacturing and mounting thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Dec 19, 2000
Grant Date -
N/A
app pub date -
Jan 29, 1999
filing date -
Jan 30, 1998
priority date (Note) -
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Abstract
In a hybrid module which is mounted on a mother circuit board with a first surface of a substrate opposed to the mother circuit board, a cavity is formed on the first surface, and a heat-generating circuit component is facedown-bonded in the cavity. Heat generated in the circuit component is radiated to the mother circuit board through a heat radiation plate.
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