Importance

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Abstract

A thermoelectric cooling assembly is provided having at least a first thermoelectric stage thermally coupled to a heat source, such as an electronic device, and a second thermoelectric stage thermally coupled to the first thermoelectric stage across a 'thermal space transformer'. The first thermoelectric stage has a first surface area for thermal dissipation and the second thermoelectric stage has a second surface area for thermal absorption wherein the second surface area is greater than the first surface area. The thermal space transformer has a first thermal conductivity in a plane transverse to a direction of primary heat flow through the first thermoelectric stage and the second thermoelectric stage, and a second thermal conductivity in a direction parallel to the direction of primary heat flow, wherein the first thermal conductivity is greater than the second thermal conductivity. In one embodiment, the thermal space transformer can comprise a graphite composite material with diamond coating on both main surfaces thereof. The thermoelectric cooling assembly can further comprise: a cold plate; a refrigeration unit coupled to the cold plate; a dc power controller for controlling dc power through the first and second thermoelectric stages; and a temperature sensor for providing feedback information to the dc power controller on temperature of the electronic device being cooled.

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First Claim