Heater chip module and process for making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 26, 2000
Grant Date -
N/A
app pub date -
Jun 19, 1998
filing date -
Jun 19, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A heater chip module is provided comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support section provided with two or more channels which define paths for ink to travel from the container to the heater chip. The heater chip is secured at its base to the support section. Carrier material located between the channels define ribs which provide a path for energy in the form of heat to travel from the heater chip to the carrier. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.
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