Equipment for UV wafer heating and photochemistry
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United States of America Patent
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Dec 26, 2000
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N/A
app pub date -
Oct 21, 1997
filing date -
Oct 21, 1997
priority date (Note) -
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Abstract
The apparatus of the present invention provides for the dual use of a UV source to heat a substrate and to facilitate photochemistry necessary for the treatment of the substrate. The present invention also provides a method for processing a substrate by heating the substrate to a temperature above ambient via UV radiation at a first power level and conditioning the substrate by exposing the substrate to a photochemically (UV) reactive chemical, or a reactive chemical that can react with a compound on the surface of the substrate to form a photochemically reactive compound, in the presence of UV radiation at a second power level.
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