Method for improving the adhesion of metal films to polyphenylene ether resins
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United States of America Patent
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Dec 26, 2000
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N/A
app pub date -
Feb 4, 1998
filing date -
Feb 4, 1998
priority date (Note) -
Expired
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Abstract
The present invention is directed to a method for improving the adhesion between a conductive laminate and a substrate material. In a preferred embodiment of the present invention, the conductive laminate is a copper film and the substrate material comprises polyphenylene ether resin. The method involves admixing a copolymer of a vinyl aromatic compound and an .alpha.,.beta.-unsaturated cyclic anhydride with the polyphenylene ether resin. The copolymer of a vinyl aromatic compound and an .alpha.,.beta.-unsaturated cyclic anhydride is preferably a polystyrene maleic anhydride copolymer or a rubber modified polystyrene maleic anhydride copolymer.
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