Thin film capacitor coupons for memory modules and multi-chip modules
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United States of America Patent
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-
Dec 26, 2000
Issued Date -
N/A
app pub date -
Jun 22, 1999
filing date -
May 23, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device including a thin capacitor coupon mounted to the backside of a semiconductor die. When mounted active surface up on a carrier substrate of a multi-chip module, the coupon is secured between the backside of the die and the substrate. When flip-chip connections or direct chip attach are employed between the die and substrate, the coupon is secured to the backside of the die. The coupons may be preformed, or formed on the die in a wafer-scale fabrication process prior to singulation of the dice.
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