Lead frame, method for manufacturing the frame, resin-molded semiconductor device and method for manufacturing the device
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United States of America Patent
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Dec 26, 2000
Grant Date -
N/A
app pub date -
Feb 4, 1999
filing date -
May 27, 1998
priority date (Note) -
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status (Latency Note)
Importance
Abstract
The lead frame of the present invention includes: an outer frame having an opening; a plurality of leads consisting of outer and signal-connecting leads and extending inside the opening from the outer frame toward a region in which the semiconductor chip is mounted; a die pad disposed inside the opening; and a plastic film adhered to respective lower surfaces of the die pad, the outer frame and the signal-connecting leads. This lead frame is not provided with support leads and the die pad is indirectly supported by the outer frame with the plastic film. Since no support leads are provided, the size of an installable semiconductor chip can be enlarged and the overall size of a semiconductor device can be reduced.
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