Semiconductor device with a thickness of 1 MM or less
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Dec 26, 2000
Grant Date -
N/A
app pub date -
Aug 22, 1996
filing date -
Aug 25, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device with a thickness of 1 mm or less is disclosed, that comprises a frame plate main body with a thickness in the range from 0.1 mm to 0.25 mm, a semiconductor pellet disposed on a first surface of the frame plate main body and with a thickness in the range from 0.2 mm to 0.3 mm, an external connection lead, one end thereof being connected to a peripheral portion of the first surface of the frame plate main body, the other end thereof extending to the outside of the frame plate main body, a bonding wire for electrically connecting an electrode of the semiconductor pellet and a connection portion of the end of the external connection lead, and a sealing resin layer for covering and sealing at least a region including the semiconductor pellet, the bonding wire, and a connection portion.
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