US Patent No: 6,166,911

Number of patents in Portfolio can not be more than 2000

Semiconductor integrated circuit card assembly

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Importance

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Abstract

Provided is a semiconductor assembly, comprising a circuit board (1) including a conductor circuit (4), the conductor circuit including connecting pads, a semiconductor chip (2) provided with connecting terminals provided on a first surface thereof, and mounted on the circuit board, a casing (5) covering the circuit board, wherein the connecting pads of the conductor circuit and the connecting terminals of the semiconductor chip are disposed in mutually opposing relationship, and are connected with each other by an electroconductive bonding agent, a neutral plane of the semiconductor chip substantially coinciding with an overall neutral plane of the semiconductor assembly.

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First Claim

Related Publications

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HITACHI CHEMICAL COMPANY, LTD.TOKYO1077
HITACHI, LTD.TOKYO32320

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mikami, Yoshikatsu Shimodate, JP 6 235
Nishi, Kunihiko Kokubunji, JP 119 2034
Suzuki, Masakatsu Katano, JP 50 558
Usami, Mitsuo Tachikawa, JP 91 1014

Cited Art

Patent Info (Count) # Cites Year
 
ASSA ABLOY AB (2)
5,574,470 Radio frequency identification transponder apparatus and method 161 1995
5,608,417 RF transponder system with parallel resonant interrogation series resonant response 90 1996
 
CASIO COMPUTER CO., LTD. (2)
4,719,140 Electronic memory card 23 1986
4,889,980 Electronic memory card and method of manufacturing same 15 1988
 
APTEK INDUSTRIES, INC. (1)
5,703,755 Flexible electronic card and method 37 1997
 
GEMPLUS CARD INTERNATIONAL (1)
5,671,525 Method of manufacturing a hybrid chip card 71 1995
 
REGIE AUTONOME DES TRANSPORTS PARISIENS (1)
5,714,744 Wave pickup in the form of a printed coil for an electronic portable object such as a no-contact card or badge 7 1996
 
SHOEI PRINTING CO., LTD. (1)
4,754,319 IC card and method for manufacturing the same 25 1987

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
L-1 SECURE CREDENTIALING, INC. (FORMERLY KNOWN AS DIGIMARC CORPORATION) (4)
7,793,846 Systems, compositions, and methods for full color laser engraving of ID documents 0 2002
7,824,029 Identification card printer-assembler for over the counter card issuing 1 2003
7,823,792 Contact smart cards having a document core, contactless smart cards including multi-layered structure, PET-based identification document, and methods of making same 0 2004
7,789,311 Three dimensional data storage 0 2007
 
HITACHI, LTD. (3)
6,259,158 Semiconductor device utilizing an external electrode with a small pitch connected to a substrate 12 1999
6,554,194 IC card and its manufacturing method 4 1999
6,841,871 Semiconductor device utilizing pads of different sizes connected to an antenna 5 2001
 
GEMPLUS (2)
6,425,526 Contactless card comprising inhibiting means 2 2001
6,769,619 Electronic module for chip card 1 2002
 
CHECKPOINT SYSTEMS INTERNATIONAL GMBH (1)
6,622,921 Identification element 5 1999
 
GEMPLUS S.C.A. (1)
6,435,414 Electronic module for chip card 5 1999
 
NCR CORPORATION (1)
8,238,095 Secure circuit board assembly 0 2009
 
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. (1)
7,619,282 Hybrid circuit and electronic device using same 1 2006
 
SONY CORPORATION (1)
7,377,446 IC card 9 2003
 
TERADATA US, INC. (1)
6,429,386 Imbedded die-scale interconnect for ultra-high speed digital communications 2 2001