Semiconductor integrated circuit card assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 26, 2000
Grant Date -
N/A
app pub date -
Nov 20, 1997
filing date -
May 23, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Provided is a semiconductor assembly, comprising a circuit board (1) including a conductor circuit (4), the conductor circuit including connecting pads, a semiconductor chip (2) provided with connecting terminals provided on a first surface thereof, and mounted on the circuit board, a casing (5) covering the circuit board, wherein the connecting pads of the conductor circuit and the connecting terminals of the semiconductor chip are disposed in mutually opposing relationship, and are connected with each other by an electroconductive bonding agent, a neutral plane of the semiconductor chip substantially coinciding with an overall neutral plane of the semiconductor assembly.
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