Method of manufacturing and testing an electronic device, and an electronic device

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United States of America Patent

PATENT NO 6167614
SERIAL NO

09392068

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of manufacturing and testing an electronic circuit, the method comprising forming a plurality of conductive traces on a substrate and providing a gap in one of the conductive traces; attaching a circuit component to the substrate and coupling the circuit component to at least one of the conductive traces; supporting a battery on the substrate, and coupling the battery to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap; verifying electrical connections by performing an in circuit test, after the circuit component is attached and the battery is supported; and employing a jumper to electrically close the gap, and complete the circuit, after verifying electrical connections. An electronic circuit comprising a substrate; a plurality of conductive traces on the substrate, with a gap in one of the conductive traces; a circuit component attached to the substrate and coupled to at least one of the conductive traces; a battery supported on the substrate and coupled to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap; and a jumper electrically closing the gap and completing the circuit, the jumper comprising conductive epoxy.

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Patent Owner(s)

Patent OwnerAddress
ROUND ROCK RESEARCH LLC26 DEER CREEK LANE MT KISCO NY 10549

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lake, Rickie C Eagle, ID 134 5183
Medlen, Curtis M Boise, ID 9 374
Tuttle, Mark E Boise, ID 290 10704

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