Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus
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United States of America Patent
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Jan 2, 2001
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N/A
app pub date -
Dec 14, 1998
filing date -
Aug 13, 1996
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Abstract
The present invention provides a method and apparatus for conditioning a polishing pad in which slurry is directed under pressure at the polishing pad. Additionally, energy (i.e., ultrasonic energy) may be added to the slurry as it is directed towards the polishing pad, wherein embedded material in the polishing pad is removed or dislodged.
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