Touchless stabilizer for processing spherical shaped devices
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United States of America Patent
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-
Jan 2, 2001
Grant Date -
N/A
app pub date -
Apr 24, 1998
filing date -
Apr 24, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for securing a device, such as a spherical shaped semiconductor integrated circuit, for fabrication. The apparatus includes a plenum having an input and several outputs. The input of the plenum is connected to a pressurized fluid source. The outputs are separated into two groups: a centralized output and several peripheral outputs. The outputs connects to apertures located on a top surface of the apparatus. The centralized apertures expel the pressurized fluid from the fluid source to suspend the spherical shaped semiconductor integrated circuit device above the top surface. The peripheral apertures expel the pressurized fluid from the fluid source to secure the device above the centralized apertures.
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