Method and device for stacking substrates which are to be joined by bonding
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United States of America Patent
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-
Jan 2, 2001
Grant Date -
N/A
app pub date -
Apr 8, 1994
filing date -
Jun 17, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and an apparatus are proposed in order to bond multilayered substrate packages over a large surface at uniform heating in the course of one single work step, wherein the structured substrates are to begin with aligned to one another with high precision to correspond to the structuring in a working area separate from the heating apparatus.
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