Process of mounting spring contacts to semiconductor devices
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United States of America Patent
Stats
-
Jan 2, 2001
Grant Date -
N/A
app pub date -
Feb 8, 2000
filing date -
Nov 16, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for providing a plurality free-standing resilient contact structures (spring elements) mounted to a surface of a carrier substrate. The carrier substrate is mounted to a surface of a semiconductor device, or one or more unsingulated semiconductor dies. Bond pads of the semiconductor device are connected to the spring elements by bond wires extending between the bond pads and terminals associated with the spring elements. The carrier substrate is mounted to one or more semiconductor devices prior to the semiconductor devices being singulated from a semiconductor wafer upon which they are formed Resilience and compliance to effect pressure connections to the semiconductor device are provided by the spring elements extending from the carrier substrate, per se.
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