Ink jet heater chip module including a nozzle plate coupling a heater chip to a carrier
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United States of America Patent
Stats
-
Jan 9, 2001
Grant Date -
N/A
app pub date -
Jun 19, 1998
filing date -
Jun 19, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A heater chip module is provided comprising a rigid carrier, a nozzle plate and a heater chip. The carrier is adapted to be secured to a container for receiving ink. The carrier includes an opening extending completely through the carrier. The opening has an outer periphery. A nozzle plate is coupled to the carrier and extends out beyond the outer periphery of the opening so as to substantially cover the opening. A heater chip is positioned within the opening and is coupled directly to the nozzle plate. The heater chip is coupled to the carrier only by way of the nozzle plate. Thus, the heater chip does not directly contact the carrier.
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