Freestanding multilayer wiring structure
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United States of America Patent
Stats
-
Jan 9, 2001
Grant Date -
N/A
app pub date -
Jul 30, 1999
filing date -
Apr 22, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A dielectric wiring structure and method of manufacture therefor. Successively formed wiring layers synergistically combine with subsequently formed sidewall supports spanning two or more layers to form a self supporting air dielectric interconnection matrix. Wires are supported by vertical nitride sidewalls which are, in turn, held in place and supported by the wires. After forming the complete wiring-sidewall structure, SiO.sub.2 between and under the wires is removed using gaseous HF at a partial pressure between 5 and 30 Torr. The metal wires may be clad with nitride for short and oxidation protection. Because sidewalls are formed after wiring, with the wiring at each level providing support definition, complex support alignment is unnecessary.
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Cited Art Landscape
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